— Embedded Systems Beijing Forum 17th Seminar to be Held in December
In recent two years, a lot have changed in the Integrated Circuit (IC) industry. Namely there are three noticeable trends:
First, there have been many high profile mergers. For example, $16.7 billion acquisition of Altera by Intel, $37 billion merger of Avago and Broadcom, and $11.8 billion NXP-Freescale merger. The number of merger and the amount of money involved have been very high during the period, especially for embedded chip manufacturers. The overall slowing down of the industry is likely to be an important factor behind the mergers.
Second, mobile device manufacturers, such as Apple, Samsung and Huawei, have joined in the competition of chip design, alternating the landscape profoundly. With the acquisition of Altera, Intel is making clear its CPU+FPGA vision, while Apple is working on System+Silicon pattern with the purchase of PA Semi. Shaojun Dai, Chairman of the Institute of Microelectronics at Tsinghua University, predicted that the market share of device manufacturers’ own chip will rise from 4% in 2010 to 14.15% in 2020. Juyan Xu, member of China Engineering Academy, Co-founding member of ESBF and expert in Microelectronics, indicated that SoC and related services are expanding in a faster rate than the general industry. What does this imply? And what could be the future development? Xu suggested that industry and academic should both focus on the growth of SoC.
Third, global semiconductor industry is experiencing a slowdown, shipments of PC and smartphone are declining. And chip manufacturers are starting to aim at new growing points like Internet of Things.
Back in March 2009, ESBF held the seminar titled “Integrated Circuit Industry and Embedded System”. After five years, as the industry has changed dramatically, we will once again discuss the role of IC in embedded system. As such, the topic of the upcoming seminar is “The Integration of Global Integrated Circuit Industry and the Development of Embedded System”.
Experts are invited to the seminar to share their understanding and observation on IC technology and industry, and also envision what’s next in Chinese IC and Embedded System industry. Speakers include: Xing Zhang, Chairman of School of Software and Microelectronics at Peking University; Zhimin Zhang, researcher at Laboratory of Computer Architecture, Chinese Academy of Sciences; Dr. Haili Wang, Capital Microelectronics; Lin Wang, Vice President of Walden International; and Xin Shi, Senior Manager of Software Collaboration and Solution, AMD Greater China Region.
Date and Time: 9:00 am – 4:30 pm, December 19th 2015
Location: Room A849, New Main Building, Beihang University, Beijing
Organizer: Embedded Systems Beijing Forum
Partner: Beijing University of Aeronautics and Astronautics Press
Morning: Speaker Series
|Xing Zhang, Chairman of School of Software and Microelectronics at Peking University
“Nano-electronics in Post-Moore Era”
|Zhimin Zhang, researcher at Laboratory of Computer Architecture, Chinese Academy of Sciences
“High-performance Embedded Processor: Development and Strategy”
|Dr. Haili Wang, Capital Microelectronics
“FPGA: Yesterday, Today and Tomorrow”
|Lin Wang, Vice President of Walden International
“New Landscape of Semiconductor in China, and Opportunity for Embedded Software”
|Xin Shi, Senior Manager of Software Collaboration and Solution, AMD Greater China Region
“Recent Trends of IC – Decision and Preparation of AMD”
|Lunch (3rd Floor, Training Cafe)
Afternoon: Topic Discussion
|Dr. Xinxin Yang, Director of Digital Network Solution Department, NXP China
“Latest Development of SoC, Embedded Software and Linux”
(1) Will Internet+IC change Chinese Semiconductor Market?
(2) Will the new microelectronic institute be the solution to the rising demands of professionals?