The 7th Embedded Technology Conference China Concluded in Shenzhen

The 3-day elexcon 2025 was held in Shenzhen Conference Center from August 26th to 28th. The 7th Embedded Technology Conference China (ETCC 2025), as a concurrent event, concluded at the same time with with a keynote speech, 4 sub-forums, and a total of 30 technical presentations. The three-day event was well-attended, attracting engineers and developers from all over the country. According to the organizer, the conference attracted over 1300 professional visitors, a record high.

The keynote speakers were Ms. Qing Shen, Marketing Director for China at Renesas Electronics’ Embedded Processor Business Unit, and Mr. Dalong Li, Director of Product Marketing at Qualcomm Technologies. Ms. Shen provided an overview of Renesas’ embedded processor products and application development plans, while Mr. Li highlighted Qualcomm’s Yuelong brand, a new product line launched for the Chinese market, which aims to empower the industrial and embedded Internet of Things (IoT) industries. Sub-forums of ETCC 2025 included “Embedded AI, Edge Intelligence, and the AIoT Ecosystem,” “Embedded Embodied Robotics Systems and Applications,” “Storage Technology,” and “Industrial Control and Applications.” Experts from ARM, Renesas, NXP, ADI, Imagination, Wind River, Silergy, Hangshun, Rocktech, Sunlord, Kowin, MPS, Dosilicon, ForwardX Robotics, Yangtze Memory Technologies, and Huawei Technology (Tianjin) participated in the presentations. In the area of ​​embedded software and ecosystem, there were excellent remarks from the Provincial Key Laboratory of Embedded Computing at Hunan University, RT-Thread, Wind River, and Volcano Engine.

In his opening remarks, Mr. Allan He, Chairman of ETCC, noted that after six years of growth, the conference has gained widespread recognition in both the industry and the academia. Thanks to the conference’s influence, embedded technology has become increasingly popular, and intelligent embedded system technology is growing faster than ever.

Ms. Qing Shen, Marketing Director of China, Embedded Processor Business Unit, Renesas Electronics
Mr. Dalong Li, Director of Product Marketing, Qualcomm Technologies
Mr. Jiping Liu, Founder, Chairman, and CEO, Hangshun Chip
Mr. Zengxu Fan, Senior Marketing Director, Yangtze Memory Technologies
Mr. Allan He, Conference Chairman and Secretary-General of ESBF
Professor Jinlong Lin, Conference Expert Committee Member, Peking University
Associate Professor Sheng Bi, Conference Expert Committee Member, South China University of Technology
Audience Members Discussing