As the IT industry AI boom continues on, leading companies are accelerating R&D and investment in AI data centers and storage technologies, as well as related storage products. Within the embedded systems sector, the focus lies on ubiquitous edge computing, embodied AI, and core technologies such as AI sensing, AI SoCs, AI MCUs, inference acceleration, and software ecosystems. The 2026 International Embedded System Innovation Forum, held alongside electronica China, concluded successfully on July 1; experts and scholars from organizations including Arm, ST, ADI, RECOM, MIPS, Renesas, Xiamen University, ShanghaiTech University, and Bocheng Jingwei Group delivered presentations on embedded AI technologies and industry trends. The forum saw active interaction between the audience and guest speakers, with Beihang University Press gifting new books on embedded AI and RISC-V to the audience members in the Q&A session.
The first speaker of the morning session was Ziying Fan, Senior Marketing Manager of Arm China. Her presentation is titled “Zephyr on Arm Platforms: Scaling from Cortex-M to Cortex-A to Power Edge AI.”
The second speaker was Deyong Chen, Director of the STM32 Wireless Product Line within the Microcontrollers, Digital ICs, and RF Products Division of STMicroelectronics China. The presentation topic: “Applications of STM32 Bluetooth® LE in Industrial AIoT.”
The third speaker was Jianqiang Liu, Senior Engineer of RECOM China. The presentation topic: “A Fast-response Loop Compensation Chip for the Switch and Power Supply Field”.
The final speaker of the morning session was Dr. Yonglong Xu, Dean of the Research Institute and Chief Scientist of Bocheng Jingwei Group. The presentation topic: “Embedded AI Technologies and Applications”.
The morning forum was moderated by Allan He, Secretary in Chief of ESBF.
The first speaker of the afternoon session was Professor Jianyang Zhou from Xiamen University. The presentation topic: “Embedded AI Technologies and Applications Based on the Open-Source Coral NPU”.
The second speaker of the afternoon session was Haitao Jiang, Senior Marketing Manager of ADI’s Instrumentation Business Unit. The presentation topic: “Breaking R&D Bottlenecks and Reducing Time-to-Market: ADI’s System-Level Solutions for Instrumentation Applications”.
The third speaker of the afternoon session was Lingfeng Shi, Senior Manager of Marketing in the Embedded Processor Business Unit in Renesas. The presentation topic: “Building an Edge Intelligence Technology Ecosystem to Accelerate Industrial AI Implementation”.
The fourth speaker of the afternoon session was Professor Yajun Ha from ShanghaiTech University. The presentation topic: “Edge AI Computing in the Post-Moore Era”.
The fifth speaker of the afternoon was Yong Li, Head of Business Development for China at MIPS (a GlobalFoundries company). The presentation topic: “MIPS: Breaking Through Physical AI Efficiency Barriers and Enabling Efficient AI Deployment Across Use Cases – from IoT to Automotive”.
The final presentation of the afternoon session was delivered by Allan He, Secretary in Chief of ESBF. The presentation topic: “The Current State of the Embedded Systems Industry and RISC-V Development Trends”.
The afternoon forum was moderated by Xiaobai Hu, an Associate Editor at Beihang University Press.
The International Embedded System Innovation Forum was jointly organized by Messe München (Shanghai) Co., Ltd. and ESBF. For more information about the forum, please visit https://www.electronicachina.com.cn/en.