2020 Embedded Technology Conference: Embedded AI Under the Spotlight
AIoT, represented by autonomous driving, intelligent robotic and smart security, is now under the spotlight of technical innovation in Information Technology. The deployment of 5G will also boost device-side intelligence. While AIoT is a technically combination of AI technology and IoT device, it is also a realization of AI and IoT in application scenarios. Embedded technology provides an important platform for AI.
China’s Ministry of Industry and Information indicated in their 2019-2020 Report of Talents in the AI Industry that there is a general shortage of talents in AI, and that there is a misalignment between current labor force ability and market demand. AI development engineer, system/platform engineer and software engineer are among the top 10 job posts of the most severe shortages; they represent new possibilities of embedded system engineers.
Embedded AI is in the spotlight during the 2020 Embedded Technology Conference. This year the event consisted of one main event and 4 sub-forums, spanning over 2 days. With 27 keynote sessions, the event this year aimed for broader and deeper technical coverage.
Embedded Technology Conference expert committee member and ESBF secretary in chief Allan He gave a passionate opening speech, Beijing Institute of Technology Professor Hongbin Ma’s speech was titled “Embedded AI and AI Chip”, and Hunan University Associate Professor Guoqi Xie’s delivered keynote “Automobile Embedded System Development: Theories and Solutions”. Three CEOs of embedded system startups: Puxiang Xiong of RT-Thread, Shenzhen SDJ Tech’s Luye Wang and Beijing Gonlon Electronic Technology’s Tianxiao Lin spoke about IoT OS, RISC-V and micro MCU programming; entrepreneurship in embedded industry is key to innovation.
Embedded Technology Conference expert committee member and South China University of Technology Associate Professor Sheng Bi hosted the “Embedded AI and Application” sub-forum, experts from Arm China, Huawei, Imagination and Huaqing Yuanjian talked about AI chip, GPU acceleration, MindSpore AI application and embedded AI education.
The conference was held by CETimes, ESBF and Dianziq, together we aim to build a platform in southern China, greater China area, and Asia-Pacific region to socialize about embedded technology and products; we also hope contribute to continuous innovation in China’s electronic and information industries.
Agenda / Keynotes Download
Date: September 9-10, 2020
Hosted by: CETimes, ESBF, Dianziq
Main Keynotes
Time: Morning, September 9
Location: Shenzhen International Conference Center (Bao’an) Building 9, Conference Room B
Host: Allan He, ESBF Secretary in Chief
| Time | Topic | Speaker |
| 10:00-10:30 | Embedded AI and AI Chip | Hongbin Ma, Professor / Doctoral Advisor, Beijing Institute of Technology School of Automation |
| 10:30-11:00 | IoT OS: From RTOS to Microkernel OS | Puxiang Xiong, Co-founder, Shanghai RT-Thread Technology |
| 11:00-11:30 | Automobile Embedded System Development: Theories and Solutions | Guoqi Xie, Hunan Province Embedded System and Network Computing Lab, Hunan University |
| 11:30-12:00 | Practice of Digitization Across the Industrial Chain | Luye Wang, General Manager, Shenzhen SDJ Tech |
| 12:00-12:30 | Unity OS and Nanokernel | Tianxiao Lin, General Manager, Beijing Gonlon Electronic Technology |
Sub-Forum 1: Software/Hardware Technology in IoT Development
Time: Morning, September 9
Location: Shenzhen International Conference Center (Bao’an) Building 9, Conference Room C
Host: Sheng Bi, Associate Professor, South China University of Technology
| Time | Topic | Speaker |
| 10:00-10:30 | Non-touch Vital Signs Sensing Technology and Application | Mengxiang Ye, Chief Algorithm Architect, Hefei Genvic Electronics |
| 10:30-11:00 | Hangshun 32-bit MCU in Medical Electronics | Shuiping Chen, Senior FAE / Product Manager, Shenzhen Hangshun Semiconductor Technology and Research |
| 11:00-11:30 | Market-Specific Customizable Embedded System Applications | Hongwei Chen, Product Director, Shenzhen Biwin Storage Technology |
| 11:30-12:00 | MM32 MCU’s Applications in Intelligent Products | Hui Che, Site Technology Manager, Shanghai MindMotion |
| 12:00-12:30 | 5G Empowers Intelligent Connected Things, Chinese Chips Accelerates Connection and Sharing | Lei Chen, Vice President – Marketing, DoSolicon Semiconductor |
Sub-Forum 2: IoT Security
Time: Afternoon, September 9
Location: Shenzhen International Conference Center (Bao’an) Building 9, Conference Room C
Host: Guoqi Xie, Associate Professor, Hunan University
| Time | Topic | Speaker |
| 14:00-14:30 | You-IP@Secure Based Secure Chip Design Solution | Hongming Hu, System Design Director, Brite Semiconductor (Shanghai) |
| 14:30-15:00 | Security Requirements if IoT Systems and Software/Hardware Solutions | Zhihao Mo, Senior Application Engineer, NXP Semiconductor (Shanghai) |
| 15:00-15:30 | Network Security Issues in Intelligent Car Networking and Intrusion Detection Technologies | Wufei Wu, Lecturer, Nanchang University School of Information Engineering |
| 15:30-16:00 | Secure IoT OS MS-RTOS | Guizhou Xu, Vice General Manager, Beijing AcoInfo Technology |
| 16:00-16:30 | PSA-Compliant “Xingchen” Processor and “Shanhai” Security Solution | Junchao Wang, Director of Marketing – Security Technology, Arm China |
| 16:30-17:00 | Chip-Level Security in IoT Applications | Yonggang Zhao, Execution Director, Nations Technologies |
Sub-Forum 3: RISC-V Development and Application
Time: Morning, September 10
Location: Shenzhen International Conference Center (Bao’an) Building 9, Conference Room C
Host: Allan He, ESBF Secretary in Chief
| Time | Topic | Speaker |
| 10:00-10:30 | Exploration of Embedded Software Platform with Open-Source RISC-V | Huaqi Fang, Embedded Technology Director, Nuclei System Technology |
| 10:30-11:00 | Porting of ComputeLibrary based on RISC-V Vector Instructions | Xicong Ye, Software/Toolchain Engineer, Shenzhen SDJ Tech |
| 11:00-11:30 | Professional Development Tools Empowers RISC-V in Embedded System | Yuanbin Fu, Embedded Software Engineer, Beijing BRM Software Technology |
| 11:30-12:00 | Low-Power Embedded AI Application | Xuehui Lu, FAE, Greenwaves Technologies |
| 12:00-12:30 | Developing Doit Technology RISC-V Based Communication Module Ecosystem | Honggang Li, R&D/CEO, Shenzhen Doit Technology |
Sub-Forum 4: Embedded AI and Application
Time: Afternoon, September 10
Location: Shenzhen International Conference Center (Bao’an) Building 9, Conference Room C
Host: Sheng Bi, Associate Professor, South China University of Technology
| Time | Topic | Speaker |
| 14:00-14:30 | Arm’s Brand New Cortex-M55 Brings Unprecedented Power to Node-Side AI | Rui Yang, Senior Embedded System Marketing Manager, Arm China |
| 14:30-15:00 | AIoT Application in TmallGenie and AIoT Education | Songhua Yi, Embedded System Senior Marketing Manager, Huaqing Yuanjian Technology Development Company |
| 15:00-15:30 | MindSpore AI Technology and Its Application in LiteOS | Zhiqiang Zhai, Node-Side Architect, Huawei MindSpore AI Project |
| 15:30-16:00 | Software/Hardware Solutions for 2.5D Graphic Acceleration in MCU Environment | Tian Xiang, CEO, Suzhou GraphiChina Electronics Technology |
| 16:00-16:30 | GPU and Neuron Network Accelerator Based Asymmetrical Computing Platform | An Li, China Area Chief Technical Specialist, Imagination Technologies |
| 16:30-17:00 | Evolution of AI Chip Technology and Introduction to Zhouyi AIPU | Tong Wu, Senior AI Technology Market Manager, Arm China |